AI Is Needed To Make Semiconductor Engineering Work More Productive

Agentic AI is fundamentally changing how engineers approach design and verification. The ability to effectively use these tools will be a requirement in this industry.

How Priceline’s CTO Is Rebuilding Travel With AI

Priceline CTO Sejal Amin explains how the company rebuilt its org model, built its AI assistant Penny and is rethinking voice and agentic booking.

Solid Growth For Digital Storage In Media And Entertainment

Digital storage and memory vendors are creating new storage products to meet the needs of video professionals so they have the tools they need to express their visions.

How NetApp Is Simplifying Its Way To An AI-Powered Enterprise

NetApp’s Gus Shahin argues that most companies don’t have a tech problem. They have a complexity problem. His fix starts with people, not technology.

Qolab Wants To Rewrite The Rules For Superconducting Quantum Hardware

Led by quantum industry pioneers, the startup aims to overcome challenges in qubit yield and component integration using advanced semiconductor manufacturing techniques.

IEEE SPACE Conference Showed How Outer Space Industry Can Prosper

IEEE SpaceTech committee brings together experts, companies and governments enabling outer space development. The IEEE SPACE conference demonstrated these activities.

AI Storage & Memory From Backblaze, CoreWeave, Panmnesia, Vast And Cloudera

AI storage announcements by Backblaze, CoreWeave, Panmnesia and Meta, as well as Cloudera and Vast provide data where it is needed in the AI workflow.

AI Storage And Memory From Backblaze, CoreWeave, Panmnesia, Vast And Cloudera

AI storage announcements by Backblaze, CoreWeave, Panmnesia and Meta, as well as Cloudera and Vast provide data where it is needed in the AI workflow.

Microsoft Doubles Down On Topological Qubits With Majorana 2 Chip

The Majorana 2 quantum chip embodies Microsoft’s efforts to use a topological architecture to pursue fault-tolerant quantum computing.

Memory Capacity Production Slowly Expanding To Meet AI Industry Demand

Samsung, SK hynix, Sandisk, Kioxia and Micron report building out new DRAM and NAND flash manufacturing and packaging facilities coming on line in late 2027 or 2028.