Micron rejects 4F2, intends to use wafer bonding and High-NA EUV before going 3D NAND over the next few years.
Micron believes that more advanced process technologies will present more benefits in terms of DRAM bit density than smaller memory cells.
Samsung and SK Hynix are reportedly upgrading their factories to produce more advanced RAM chips designed for AI data centers in an attempt to fend off competition from Chinese companies.
Micron’s Taiwan union is set to conduct a one-day strike at the company’s Taoyuan DRAM facility as workers demand bonuses for this year and transparent terms of bonuses for upcoming years.
A hobbyist converted a SK hynix 2x 16GB DDR5-5600 SODIMM kit they got off Facebook Marketplace for $120 into a DDR5-7800 desktop kit.
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Elon Musk condemns memory makers citing unreasonable prices of memory, but claims Micron is different.
32GB of DDR5 6000 RAM now costs $450, as supply for consumer DIMMs remains constrained.
CXMT president Cao Kanyu says the company’s first 4F² DRAM product will be a DDR5 RDIMM for servers, expected by the end of 2026.
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