Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel’s 2.5D EMIB for HBM integration

The rally followed a report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel’s EMIB technology.
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Apple reportedly strikes deal for Intel to make some of its chips — two tech giants reached a preliminary agreement for Intel to make processors for Cupertino

Intel and Apple have reportedly reached a deal in which the former will manufacture chips for the latter.

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Global semiconductor sales hit nearly $300 billion in Q1 2026 — chips are on track to top $1 trillion for this year, says report

Sales of chips in Q1 2026 hit $298.5 billion and are on track to exceed $1 trillion this year, according to the Semiconductor Industry Association.
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Inside The Largest Humanoid Robot Data Factory In The United States

Meet Sonny. Inside the warehouse that made the sailcloth for the USS Constitution, this vaguely humanoid robot is part of an attempt at reinventing work.

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Apple considering Intel and Samsung for US chip production, report claims — consumer electronics giant looks to diversify supply chain amid chip shortages

Apple is reportedly in early talks with Intel and Samsung to secure more production for its advanced chips, as the company is constrained by the limited availability of advanced nodes that its SoCs are produced on.
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China pushes for 70% homegrown silicon wafer use as domestic firm ramps up 12-inch production — government seeking to localize critical chip supply chain amid AI boom and export restrictions

China is targeting 70% local wafer sourcing as firms like Eswin scale 12-inch production, aiming to reduce reliance on foreign suppliers and support growing AI chip demand.
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ASML’s roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond

ASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating €32.7 billion in total revenue and ending the year with a €38.8 billion order backlog.
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Intel details 18A-P process node, touts higher performance, lower power, and better thermals — 9% more performance, thermal conductivity improved by 50%

Intel details improvements of 18A-P that include higher performance, lower power, reduced variability, improved yields, and more.
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1X Kicks Off Full-Scale Production Of Humanoid Robot Neo

Are we nearing the tipping point for humanoid robots? We actually might, given that 1X just hit full-scale manufacturing of Neo.

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TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 4.5-micron in 2029 — Fujitsu’s Monaka CPU to benefit from face-to-face chiplet stacking

TSMC adds support for face-to-face stacking, 6.5 µm and 4.5 µm pitches for the next generation of SoIC 3D stacking.
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