Tencent-backed chipmaker Enflame nearly triples in its Shanghai debut
 Tencent-backed chipmaker Enflame nearly triples in its Shanghai debut

Shares in Shanghai Enflame Technology closed 179% above their offer price on their first day of trading on Shanghai’s Star Market on Friday. The Tencent-backed AI chipmaker had raised about 6.12bn yuan ($911m) in its initial public offering, Bloomberg …

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Celero raises $275m to bring coherent optics inside AI data centres
 Celero raises $275m to bring coherent optics inside AI data centres

Celero Communications, a two-year-old chip startup, has raised $275m in a Series C round that values it at more than $3bn. It makes the processors that push data down fibre optic cables between AI chips, racks and whole data centres. Atreides Managemen…

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Chinese quartz approved for semiconductor equipment and DRAM manufacturing, but it still can’t break America’s monopoly — China secures domestic supply for chipmaking components, but Spruce Pine still holds the crucible monopoly
 Chinese quartz approved for semiconductor equipment and DRAM manufacturing, but it still can’t break America’s monopoly — China secures domestic supply for chipmaking components, but Spruce Pine still holds the crucible monopoly

Pacific Quartz gets its high-purity quartz qualified for semiconductor equipment and DRAM manufacturing.

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The state of ABF substrates in data center silicon in 2026 — solving the supply crunch and material wall beneath every AI accelerator
 The state of ABF substrates in data center silicon in 2026 — solving the supply crunch and material wall beneath every AI accelerator

ABF substrates underpin today’s most advanced AI chips, but soaring demand and expanding accelerator packages are creating new supply and technical bottlenecks that the industry is currently racing to resolve

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TSMC, Samsung, and Intel shore up support with ASML to deploy larger High-NA EUV photomasks — 6×12-inch photomask transition may take years despite unified effort
 TSMC, Samsung, and Intel shore up support with ASML to deploy larger High-NA EUV photomasks — 6×12-inch photomask transition may take years despite unified effort

ASML, Intel, Samsung, and TSMC back development of 6×12-inch to build large processors using High-NA EUV lithography systems without stitching.

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The average American PC now costs more than $1,000
 The average American PC now costs more than $1,000

The average PC sold in the United States now costs more than $1,000. That has never happened before. Average sell-in prices crossed the line in the second quarter, up 12.0% year on year, according to Omdia. US shipments grew 1.0% in the quarter to 18.8…

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Amkor is taking its Arizona chip packaging campus to $12bn
 Amkor is taking its Arizona chip packaging campus to $12bn

Amkor is roughly tripling the size of the chip packaging campus it is building in Arizona. The company announced phase 2 on Tuesday. It adds 60,000 square metres of cleanroom to the 33,000 already planned, taking the site to about 93,000 square metres,…

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Kawasaki signed an AI chip deal with a startup the Pentagon backs
 Kawasaki signed an AI chip deal with a startup the Pentagon backs

Kawasaki Heavy Industries has signed an agreement to put a startup’s AI chips into Japanese aerial defence platforms. The chip company is the interesting part. EdgeCortix, a fabless semiconductor firm based in Kanagawa, announced the deal last week, a …

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China put a 99.2% duty on a chemical chip fabs need
 China put a 99.2% duty on a chemical chip fabs need

China has imposed a cash deposit of up to 99.2% on imports of a Japanese chemical that chip fabs use to build the films inside logic and memory chips. The rate is close to prohibitive. It took effect on Tuesday. China’s Ministry of Commerce published t…

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TSMC to start using High-NA EUV lithography in 2030 — A10 or A11 technology prime candidates for use
 TSMC to start using High-NA EUV lithography in 2030 — A10 or A11 technology prime candidates for use

TSMC discloses plans to use High-NA EUV lithography in 2030, 6×12-inch photomasks with new scanners in 2033.

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