A German company designs the robot. An Italian company builds the board that goes inside it. An American company designs the chip that goes on the board. That is the European Physical AI stack as it actually exists. On Monday, two thirds of it signed a…
When Armenia opened the biggest AI factory in its region last month, we filed it under compute diplomacy. The Wall Street Journal now reports what the compute actually bought. Robbie Whelan reported on Friday that US negotiators used the promise of acc…
TSMC’s equipment requirements have nearly doubled in just eight months as AI demand drives an unprecedented fab expansion, yet its 2026 CapEx budget has risen by only around 15%.
Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic and freshly postponed on memory.
Despite rumors, there is no evidence that Chinese makers of lithography tools can produce immersion lithography scanners in quantity.
Samsung detailed a three-phase HBM roadmap at Hot Chips 2026 that progressively moves logic into the base die and ultimately stacks DRAM directly on the processor.
Google will start policing how much memory Android apps use, and it says the reason is the global shortage of RAM. From February 2027, an app that exceeds the new limits risks two penalties. Android can slow it down or shut it. The Play Store can bury …
Intel says defect density of 14A process technology is declining rapidly as internal teams are already developing 14A-based products, while external clients are now wondering about capacity that Intel can provide them.
An environmental group said that two new chemicals approved by the EPA for semiconductor manufacturing do not come with enough safeguards, so they’re suing the agency for ‘turning the new chemical review process on its head.’
Igor Arsovski, now Nvidia’s VP of hardware, presented the Groq 3 LPX rack’s architecture and published the first third-party benchmark of the hardware.