Shanghai Aishengna named as the maker of China’s first domestic immersion DUV chipmaking tools — first viable domestic 7nm-capable scanner to be completed by 2038

Aishengna has been named by a single source who declined to be named, and its shareholders, SMEE, and Yuliangsheng didn’t respond to requests for comment.

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China begins mass production of homegrown immersion chipmaking machines in major breakthrough, report claims — first DUV lithography units will be delivered this year to SMIC, Hua Hong, and CXMT
 China begins mass production of homegrown immersion chipmaking machines in major breakthrough, report claims — first DUV lithography units will be delivered this year to SMIC, Hua Hong, and CXMT

A state-backed company in Shanghai has begun mass-producing immersion deep ultraviolet lithography machines and is due to deliver the first units this year.

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New semiconductor firm breaks cover, backed by $43 million in early-stage funding — TYLsemi aims to deliver custom silicon to customers without breaking the bank
 New semiconductor firm breaks cover, backed by $43 million in early-stage funding — TYLsemi aims to deliver custom silicon to customers without breaking the bank

TYLsemi is set to offer pre-validated chiplets, along with custom ASIC design services, and build highly custom multi-tile processors at relatively low costs.

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Fortinet becomes Intel 4’s first foundry customer, following firewall ASIC deal — CEO Lip-Bu Tan’s promised foundry wins begin to surface, but on a mature node

Intel will design, package, and fabricate Fortinet’s sixth-generation Security Processor (SP6) on its Intel 4 node.

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Fashion CFOs Are Turning Sustainability Into A P&L Issue

As sustainability costs rise, fashion CFOs and supplier finance leaders are tying climate, materials and factory investments to margin and resilience.

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Intel to co-develop and manufacture Fortinet’s next-gen firewall ASIC on Intel 4 — node gets its first named external customer
 Intel to co-develop and manufacture Fortinet’s next-gen firewall ASIC on Intel 4 — node gets its first named external customer

SP6 will draw on what the companies described as Intel’s expertise in disaggregated semiconductor design and advanced packaging.

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TSMC eyes price hikes of up to 25% on chip production services in 2027, report claims — plans to raise baseline prices by 5% to 10% on advanced nodes
 TSMC eyes price hikes of up to 25% on chip production services in 2027, report claims — plans to raise baseline prices by 5% to 10% on advanced nodes

TSMC reportedly intends to increase prices of wafers it processes citing demand, rising costs, and increased investments in new capacity.

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Humanoid Raises $152 Million At $1.35 Billion Valuation: Europe’s Newest Robot Unicorn

Europe has a new unicorn. It’s the humanoid robot company Humanoid, which just raised a $152M series A

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SMIC’s third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV — analysis of N+3 shows significant advancement for Chinese semi manufacturing
 SMIC’s third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV — analysis of N+3 shows significant advancement for Chinese semi manufacturing

SMIC’s N+3 process technology can achieve transistor density comparable to TSMC’s N6 without using EUV lithography, but it fails to deliver performance or efficiency of modern production nodes.

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We Just Had The First Humanoid Robot Strike Ever

Hyundai wants to use its Boston Dynamics Atlas robots in car-making factories. Workers aren’t so sure … and the union is taking action.

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