ASML’s planned Low-NA EUV machine price hikes reportedly frustrate TSMC — lithography machine maker comes knocking to make bank on TSMC’s profitable fabs, potentially costing the Taiwanese chipmaker billions
 ASML’s planned Low-NA EUV machine price hikes reportedly frustrate TSMC — lithography machine maker comes knocking to make bank on TSMC’s profitable fabs, potentially costing the Taiwanese chipmaker billions

ASML says that the increased productivity of its Low-NA EUV tools gives it an option to increase the prices of these scanners in the future. The move may have a drastic effect on TSMC’s future expansion plans, as the foundry made a big bet on existing lithography systems.

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TSMC confirms significant yield and performance improvements in A14 update — strong interest from AI/HPC and smartphone customers
 TSMC confirms significant yield and performance improvements in A14 update — strong interest from AI/HPC and smartphone customers

TSMC’s A14 process technology progresses faster than N2 at this stage of development as developers of both client and AI/HPC plan to use it.

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ASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvements
 ASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvements

ASML’s comments point to intentions to increase prices, though the company is expected to maintain its value-based approach to price setting. Yet, TSMC is reportedly unhappy about the potential plan.

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The 4 Layers Of Brain Behind One Of Europe’s Leading Humanoid Robots

I spent an hour with Humanoid’s Sotirios Stasinopoulos in the company’s UK headquarters. In spite of huge competition, their humanoid robot strategy looks impressive.

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Tower Semiconductor revives shuttered Panasonic-era fab in $3 billion Japan photonics expansion — METI-backed plan targets $3.6 billion revenue by 2028

Tower Semiconductor has announced a dual-track expansion of its 300mm silicon photonics, silicon germanium, and advanced packaging operations in Japan

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Intel becomes the first company to ship high-volume logic chips made with ASML’s High NA EUV — select Panther Lake layers on 18A are now dual-qualified for 0.55 NA scanners
 Intel becomes the first company to ship high-volume logic chips made with ASML’s High NA EUV — select Panther Lake layers on 18A are now dual-qualified for 0.55 NA scanners

Intel is using ASML’s High-NA EUV tools to pattern select Panther Lake layers, marking the technology’s first use in high-volume logic production

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Intel’s EMIB packaging gains traction as chip designers look to skirt TSMC’s CoWoS constraints — Google’s reported decision for 9th-gen TPUs highlights Intel’s attractive alternative
 Intel’s EMIB packaging gains traction as chip designers look to skirt TSMC’s CoWoS constraints — Google’s reported decision for 9th-gen TPUs highlights Intel’s attractive alternative

Google has reportedly chosen Intel’s EMIB-T over TSMC’s CoWoS-L for its next-generation TPU, codenamed Humufish. But will Google be alone in its alleged decision?

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Researchers create programmable material that can steer heat and remember its state without power — breakthrough could eventually aid AI chip cooling and silicon photonics
 Researchers create programmable material that can steer heat and remember its state without power — breakthrough could eventually aid AI chip cooling and silicon photonics

Researchers created a programmable thermal material that steers heat and retains its state without power, a breakthrough that could benefit AI chips, silicon photonics, and infrared devices.

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Micron commits $500 million to GlobalWafers’ Texas wafer plant as it raises U.S. spending to $250 billion — memory maker aims to manufacture 40% of DRAM in the US by 2035

Running until 2035, the $250 billion spending target is attached to a goal of making 40% of Micron’s DRAM in the U.S. by the mid-2030s.

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Intel’s new space-grade Starfire chip is a Panther Lake SoC that puts an 18A CPU into orbit — chip designed for the US government leverages Intel 3 for the GPU

Intel has unveiled Starfire, a space-grade system-on-chip designed for the U.S. government.

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