Apple’s rumored M7 Ultra targets 1.5TB of memory and Blackwell-class AI performance, report claims — monster 2028 offering would depend on memory shortage easing
 Apple’s rumored M7 Ultra targets 1.5TB of memory and Blackwell-class AI performance, report claims — monster 2028 offering would depend on memory shortage easing

Apple’s planned M7 Ultra chip is being designed to support up to 1.5 TB of unified memory and to push AI performance toward the class of Nvidia’s Blackwell accelerators.

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SK hynix raises a record $26.5 billion in historic U.S. IPO — South Korean memory giant to fund massive HBM manufacturing expansions

SK hynix raised $26.5 billion in a record-breaking Nasdaq IPO, as it plans to channel the windfall from surging AI demand and sold-out HBM supply to fund new fabs.

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Japanese chipmaker Rapidus to offer lower wafer pricing than TSMC — 2nm class silicon to be priced around $20,000 on 2027 launch

Japanese chipmaker Rapidus discloses one more aspect of its strategy: to offer lower quotes than TSMC.

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Researchers turn HBM on its side to tackle AI memory’s heat wall — Korean V-Die and Japanese MOSAIC designs promise higher bandwidth, denser stacks, and cooler future GPUs
 Researchers turn HBM on its side to tackle AI memory’s heat wall — Korean V-Die and Japanese MOSAIC designs promise higher bandwidth, denser stacks, and cooler future GPUs

Researchers in Korea and Japan have proposed sideways-stacked DRAM designs that could push future AI memory beyond conventional HBM limits by improving cooling, bandwidth, and capacity while reducing reliance on TSV-heavy vertical stacks.

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Micron lifts U.S. spending to $250 billion — company takes $500 million position in America’s only 300 mm wafer plant
 Micron lifts U.S. spending to $250 billion — company takes $500 million position in America’s only 300 mm wafer plant

Micron has said it will invest up to $3 billion in the US semiconductor supply chain, with $500 million of that going to GlobalWafers.

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Manufacturers Rushed Into AI. The Returns Aren’t Showing Up

Manufacturers are adopting AI fast, but returns are lagging. The problem is often weak procurement discipline, not weak technology.

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Rapidus fab roadmap examined — first new leading-edge chipmaker in decades has one Hokkaido fab, a 2027 deadline, and 60 potential customers
 Rapidus fab roadmap examined — first new leading-edge chipmaker in decades has one Hokkaido fab, a 2027 deadline, and 60 potential customers

Rapidus is building Japan’s entire return to leading-edge logic on one fab in Chitose, Hokkaido.

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10 Jobs That Are Safe Because Robots Cost Too Much

Maybe your job is safe from the robots just because you’re cheap, and they’re expensive. But maybe that won’t last forever …

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Intel patent reveals new XBM memory architecture that ditches HBM’s costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI’s memory bottleneck
 Intel patent reveals new XBM memory architecture that ditches HBM’s costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI’s memory bottleneck

Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.

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China’s Huawei to enter South Korean AI chip market with new Atlas SuperPods, clusters pack 8,192 Ascend 950 accelerators per deployment — reportedly challenges Nvidia dominance with ‘tripled inference performance’ of H20 at one-quarter the cost
 China’s Huawei to enter South Korean AI chip market with new Atlas SuperPods, clusters pack 8,192 Ascend 950 accelerators per deployment — reportedly challenges Nvidia dominance with ‘tripled inference performance’ of H20 at one-quarter the cost

Huawei is reportedly preparing to enter South Korea’s AI accelerator market with its Ascend 950 chips and Atlas 950 SuperPod, challenging Nvidia through aggressive pricing, amid a broader push to expand its AI ecosystem beyond China

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