Igor Arsovski, now Nvidia’s VP of hardware, presented the Groq 3 LPX rack’s architecture and published the first third-party benchmark of the hardware.

d-Matrix presented Raptor, which it calls the first 3D DRAM accelerator for generative inference, showing a TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed DRAM die.

OpenAI arrived at Hot Chips on Tuesday with benchmarks claiming its first in-house chip beats Nvidia’s GB300.

Micron Fellow Raghu Sreeramaneni told the Hot Chips 2026 conference that the silicon penalty HBM carries against DDR5 is growing with every generation.

The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.

A research team at Kyoto University has built a silicon carbide transistor that operates at 600°C (873 K) using ion implantation.

LG rolls-out laser direct imaging lithography machine for chip packaging and high-density PCBs.

Nvidia has rejected a report published by The Information that it plans to begin small-batch shipments of an LPU tailored for Chinese customers by the end of 2026.