SK hynix reportedly discussing US memory chip manufacturing with Intel — options include leasing Ohio plant or forming joint venture with other AI hyperscalers
SK hynix reportedly discussing US memory chip manufacturing with Intel — options include leasing Ohio plant or forming joint venture with other AI hyperscalers

Sources say SK hynix and Intel are in talks to start HBM manufacturing in the United States. Both companies refused to confirm the rumors, though, as SK hynix could potentially be put in a precarious position as trade talks between Seoul and Washington continue.

Agility Launches Digit 5: No More Safety Cages, $300 Million In Orders

Agility Robotics is launching Digit 5, its next-generation humanoid robot that can work with humans outside the cage.

Construction Robots Just Took A Giant Leap Forward: Hello Holy Grail Of Robotics

Zinova makes physical AI called “Tool Intelligence” for construction robots. It might just be a giant leap forward in a space where robots have generally disappointed.

Micron offers Taiwan employees $31,650 cash bonus as unions threaten strike over AI windfall — workers reject record payout package, demand 15% profit-sharing plan

Micron is offering Taiwan employees a NT$1 million cash bonus, but unions have rejected the package and are demanding permanent profit sharing as strike talks continue.

The state of ABF substrates in data center silicon in 2026 — solving the supply crunch and material wall beneath every AI accelerator
The state of ABF substrates in data center silicon in 2026 — solving the supply crunch and material wall beneath every AI accelerator

ABF substrates underpin today’s most advanced AI chips, but soaring demand and expanding accelerator packages are creating new supply and technical bottlenecks that the industry is currently racing to resolve

TSMC, Samsung, and Intel shore up support with ASML to deploy larger High-NA EUV photomasks — 6×12-inch photomask transition may take years despite unified effort
TSMC, Samsung, and Intel shore up support with ASML to deploy larger High-NA EUV photomasks — 6×12-inch photomask transition may take years despite unified effort

ASML, Intel, Samsung, and TSMC back development of 6×12-inch to build large processors using High-NA EUV lithography systems without stitching.

34,000 Pre-Orders, $2.4 Billion Pipeline: Inside Europe’s Newest Humanoid Robot Unicorn

A young UK humanoid robot startup already has order pipeline of $2.4 billion … and a very unique plan to scale production to hundreds of thousands of units annually.

TSMC to start using High-NA EUV lithography in 2030 — A10 or A11 technology prime candidates for use
TSMC to start using High-NA EUV lithography in 2030 — A10 or A11 technology prime candidates for use

TSMC discloses plans to use High-NA EUV lithography in 2030, 6×12-inch photomasks with new scanners in 2033.

Belgian-Chinese semiconductor researcher arrested over alleged GaN trade-secret theft — prosecutors suspect BelGaN insiders transferred chip IP to China before the company collapsed
Belgian-Chinese semiconductor researcher arrested over alleged GaN trade-secret theft — prosecutors suspect BelGaN insiders transferred chip IP to China before the company collapsed

Belgian authorities have arrested a former BelGaN researcher on suspicion of industrial espionage, alleging that proprietary gallium nitride semiconductor technology was transferred to a Chinese rival as the Belgian chipmaker headed toward bankruptcy.