Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined — company also trailblazing giant 6×12 photomasks to speed production and lower costs
Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined — company also trailblazing giant 6×12 photomasks to speed production and lower costs

Intel is leading the semiconductor industry with High-NA fleet and process-maturity milestone as it reaches 1 million wafers processed using High-NA tools, moves forward with 6×12 photomask effort.

Inside The European Factory Where Robots Are Building Robots

“Every single person on the planet will get a personal robot,” the founder and CEO of Agile Robots told me in Munich last week. “This is not going to be very far away.”

OpenAI Is Making A Humanoid Robot. Sam Altman Says Everyone Should Have One

The maker of ChatGPT is now committed to making humanoid and other types of robots, not just the AI that powers their brains.

Protecting Dynamic Industrial Robot Cable Carriers
Protecting Dynamic Industrial Robot Cable Carriers

This article is brought to you by Tsubaki KabelSchlepp.In modern automated manufacturing, six-axis articulated robots perform high-speed, multidirectional maneuvers under demanding operational cycles. However, as robot arms swivel, rotate, and extend,…

TSMC fab equipment demand nearly doubles in six months — AI surge pushes 2026 CapEx toward $64B amid tool shortages

TSMC’s equipment requirements have nearly doubled in just eight months as AI demand drives an unprecedented fab expansion, yet its 2026 CapEx budget has risen by only around 15%.

The current state of Hybrid Bonding in 2026 — TSMC sits at 6 microns and the HBM delay that nobody expected
The current state of Hybrid Bonding in 2026 — TSMC sits at 6 microns and the HBM delay that nobody expected

Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic and freshly postponed on memory.

China’s EUV technology ‘at a similar stage to ASML in 2004,’ analyst claims — Beijing’s semiconductor industry remains well behind Western rivals
China’s EUV technology ‘at a similar stage to ASML in 2004,’ analyst claims — Beijing’s semiconductor industry remains well behind Western rivals

Despite rumors, there is no evidence that Chinese makers of lithography tools can produce immersion lithography scanners in quantity.

Hot Chips 2026: Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor
Hot Chips 2026: Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor

Samsung detailed a three-phase HBM roadmap at Hot Chips 2026 that progressively moves logic into the base die and ultimately stacks DRAM directly on the processor.

Motorless solid-state cooler uses heat to cool itself; could recycle processor heat into cooling — shape-memory alloy films could turn data center exhaust into refrigeration

German and Japanese researchers demonstrate a heat-driven elastocaloric cooler that uses shape-memory alloys to turn waste heat into cooling.

Sanctuary AI Built A Robot Body. Now It’s Also Selling A Robot Brain

Body or brain? When you’re building a humanoid robot, you have to build both. But sometimes, as Sanctuary AI found out, you don’t have to ship both at the same time.