Intel says defect density of 14A process technology is declining rapidly as internal teams are already developing 14A-based products, while external clients are now wondering about capacity that Intel can provide them.
Glass-core substrates, the replacement for organic chip packaging that Intel promised in September 2023, are now in final qualification but still not in a single commercial product
An environmental group said that two new chemicals approved by the EPA for semiconductor manufacturing do not come with enough safeguards, so they’re suing the agency for ‘turning the new chemical review process on its head.’
Which countries are best at physical AI and advanced robotics. According to a new report, it’s China, and not by a small margin.
Igor Arsovski, now Nvidia’s VP of hardware, presented the Groq 3 LPX rack’s architecture and published the first third-party benchmark of the hardware.
d-Matrix presented Raptor, which it calls the first 3D DRAM accelerator for generative inference, showing a TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed DRAM die.
OpenAI arrived at Hot Chips on Tuesday with benchmarks claiming its first in-house chip beats Nvidia’s GB300.
Micron Fellow Raghu Sreeramaneni told the Hot Chips 2026 conference that the silicon penalty HBM carries against DDR5 is growing with every generation.
The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
A research team at Kyoto University has built a silicon carbide transistor that operates at 600°C (873 K) using ion implantation.